Hirose has released a high-current board-to-board connector suited for harsh environment applications, including internal automotive powertrain and ECU connections. Supporting up to 25A per pin, the ...
PIN photodiode with improved sensitivity to visible and infrared light. Featuring a compact 3.2mm x 2mm top-view, surface-mount package with a low 0.6mm profile, the Vishay Semiconductors VEMD8083 ...
SixG301 ultra-low power IoT wireless SoC from Silicon Labs. The SoCs belong to the next-generation Series 3 platform and bring security, performance, and cost efficiency to IoT wireless product ...
Posifa Technologies has released its new PMF82000 series mass air flow sensors, combining accurate low-flow measurement with fast electrical response and a low pressure drop to enable designers ...
SemiQ Inc. has extended its family of 1200V Gen3 SiC MOSFETs, releasing five SOT-227 modules that offer RDSon values of 7.4, 14.5, and 34mΩ. Its GCMS modules, which feature SBDs, have lower switching ...
TDK Corporation has announced a significant expansion of the TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new high-performance models that can deliver up to 1000W of output ...
Impulse Embedded Ltd. introduces the Neousys GT-92RL-H to its product range. The device is a rugged, fanless GPU-accelerated railway computer built for intelligent rolling stock and demanding rail ...
This supports zonal architectures and allows OEMs to customise the system for specific requirements, leading to shorter development cycles and faster time-to-market. "The PSOC 4 HVPA-SPM 1.0 ...
ROHM’s new AI MCUs perform standalone learning and inference on-device, enabling real-time anomaly detection and predictive maintenance for industrial systems.
Claus Aasholm is Founder of Semiconductor Business Intelligence, providing memory-market analysis to suppliers, OEMs, and investors worldwide. Andrew Czuczwa is Market Research Manager at Fusion ...
Aasholm's assessment is clear: the memory market isn't correcting, it's reorganising. AI demand that doesn't defer, manufacturing strategies that favour margin over volume, and HBM's growing share of ...
Both series use GaN-based design, enabling a compact and lightweight format. The typical power density for the PGW65 is 0.37W/cm³ (6.06W/in³), for the PGW100 is 0.53W/cm³ (8.72W/in³), for the PGD100 ...