Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...
Sigrity Inc. has acquired a Synopsys Inc. worldwide perpetual unrestricted license to advanced single and multi-chip IC package design technology, including technology embodied in Synopsys’ Encore ...
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