Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Maybe you can’t judge a book by its cover—but what about consumer goods? “The Package Design Book 4” (Taschen, $59.99) showcases over 400 winning products from the past two years of the Pentawards, an ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...