3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

Arrgghhh! Will this never end? I just received an email from someone who asked: Hello Max, Would you please provide me any details about relation between Logic Elements (LEs) and System Gates count.

Increased device integration has meant that for several years chip makers have been building ASIC system chips with one or more microprocessors combined with memory and other functions such as signal ...

Engineers grappling with FPGA design have new EDA tools ready to reclaim time-to-design completion. Strategies for EDA tool usage will change course as gate levels, and ultimately costs, rise in ...

Members can download this article in PDF format. For market growth to occur at desired levels, suppliers must meet consumer demand for compact electronic devices that integrate multiple functions. To ...