Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.

FRANCE – The EIPC (European Institute for the PCB Community) is seeking abstracts for technical presentations at its Winter Conference, taking place February 3–4, 2026, in Aix-en-Provence, France.

Altus Group, a leading distributor of electronics production equipment in the UK and Ireland, is highlighting Heller Industries’ innovative Short-Cycle Vacuum Reflow Oven (SCVR) as interest in high ...