You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Abstract: According to the practical characteristics of a mid-end signal controller, such as natural heat dissipation, outdoor installation, dustproof, waterproof and anticorrosive, a simple and ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...