This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Bump scaling is pushing defect inspection to the limit. What comes next and why it matters.

Version 12.0 of Pulsonix PCB software performs 3D collision detection to reveal space violations in multi-board and folded board designs. This allows designers to visualize boards in a stacked or ...

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...