Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee ...

High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member. ...we look forward to contributing to HDP initiatives ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025, at 9:00 a.m. (UCT+2) Release category: Other information disclosed according to the rules of the Exchange Aspocomp's Board of Directors ha ...

True 3-D interconnects and packaging. Rigid PCBs are inherently 2-D. Rigid-flex, however, allows you to fold, bend and twist your circuit board into complex 3-D shapes, conforming to irregularly ...

The average age of PCB fabrication workers continues to climb. Industry surveys now peg it somewhere north of 50 years old, and the pipeline of replacements remains dangerously thin. We’re not just ...

This project gives a whole new meaning to DIY PC. We don’t know how capable you were as a teenager, but could you have ...

Ionic cooling offers a fundamentally different approach: solid-state airflow driven by electrohydrodynamic (EHD) forces that ...

The Production Linked Incentive (PLI) scheme is transforming India's Electronics Manufacturing Services (EMS) sector into a global hub, significantly boosting domestic production and investment. This ...

TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic ...

Medtech manufacturer Kalogon shares tips for making medical devices in-house and in the U.S. on a startup budget.

TTM Technologies ( TTMI 4.34%) delivered broad-based top-line growth and record non-GAAP EPS in the third quarter of 2025, with particularly strong contributions from Aerospace and Defense and ...

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...