Santa Barbara-based ChipAgents.ai today announced it raised $21M in early funding to fuel growth for its agentic artificial intelligence platform for chip design and verification.

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

Welcome to Shipshewana, Indiana, where the 21st century politely coexists with a lifestyle that would feel perfectly at home in the 1800s, and where every meal tastes like it was prepared by someone’s ...