A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Researchers at the Nankai University in China have fabricated a perovskite solar cell using a 2D/3D perovskite heterointerface that improves device stability and performance. The research team ...
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