YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Traditional system-in-package (SiP) approaches, where semiconductor chips are arranged in a two-dimensional plane (2D) using solder bumps, have size-related limitations, warranting the development of ...

He will analyze the characteristics and challenges of DRAM near-memory computing chips and share the latest research progress of his team ... as well as how to combine advanced 2.5D/3D integration ...