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A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

The computational modeling of a 3D Metamaterial beam array has been performed employing a commercially available Finite Differences Time Domain (FDTD) software package, to determine the prospective ...

This paper develops a design procedure based on the theoretical description of traveling waves supported by the 3D arrays. Analytical calculations of k-β (dispersion) diagram and effective ...

Artist’s conception of 3D Transistor Chip. Silicon integrated circuits, which are used in computer processors, are approaching the maximum feasible density of transistors on a single chip—at least, in ...