You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

Abstract: For next-generation advanced logic devices, gate-all-around field-effect transistors (GAAFETs) with characteristic size reaching the 10 nm scale, necessitate thorough consideration of ...

Abstract: The contribution deals with the creation of mathematical model and its implementation in MATLAB environment in the form of simulation model, which is proposed mainly for analysis of thermal ...