Renewable-energy applications, as well as all kinds of energy-efficiency technologies, require reliable, compact, and thermal-efficient power devices. For driving innovation in wind turbines, smart ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Even the most iconic products sometimes need a refresh to stay relevant and eye-catching on store shelves. Redesigning packaging to give a well-established product a fresh face is no small feat—it ...

Maybe you can’t judge a book by its cover—but what about consumer goods? “The Package Design Book 4” (Taschen, $59.99) showcases over 400 winning products from the past two years of the Pentawards, an ...

· Consider your users' motivations, challenges, and desires, and then identify the top 1-2 emotional associations you want consumers to connect to your brand. · With over 70 million adults living with ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...