Trade dress deals with visual appearance: how an offering in commerce (i.e., trade) looks (i.e., is dressed), for purposes of identifying the source of that offering. For CPGs, package design is trade ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

Even the most iconic products sometimes need a refresh to stay relevant and eye-catching on store shelves. Redesigning packaging to give a well-established product a fresh face is no small feat—it ...

Maybe you can’t judge a book by its cover—but what about consumer goods? “The Package Design Book 4” (Taschen, $59.99) showcases over 400 winning products from the past two years of the Pentawards, an ...

Sigrity Inc. has acquired a Synopsys Inc. worldwide perpetual unrestricted license to advanced single and multi-chip IC package design technology, including technology embodied in Synopsys’ Encore ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...

Requirements for the safe transport of radioactive material are established in IAEA Safety Standards Series No. SSR-6 (Rev. 1), Regulations for the Safe Transport of Radioactive Material, 2018 Edition ...