Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...
Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Ansys to demonstrate 3D multiphysics visualisation of electromagnetic and thermal effects in semiconductor packages at Design Automation Conference. Ansys is adopting NVIDIA Omniverse application ...
Ansys reports the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
The ANSYS Elite channel partner program is designed to promote customer success by ensuring that channel partners meet stringent certification and resource requirements. While requirements vary by ...
Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...
Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
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